There must be no deformation or change in dimension. Inductance must not change more than the stated tolerance.
There must be no case deformation or change in dimensions. Inductance must as specification stated.
There must be no case deformation or change in dimensions. Inductance must as specification stated.
There must be no case deformation or change in dimensions. Inductance must as specification stated.
There must be no case deformation or change in dimensions. Inductance must as specification stated.
Solder inductors on the test PCB.After vibration, there must be no deformation or change in dimension. Inductance must not change more than the stated tolerance.
2
Humidity Resistance
Humidity: 90%~ 95% RH
Temperature: 40± 2 o C
Test Time: 500± 12 Hours
3
HighTemperature
Temperature: 85± 2 o C
Humidity: 20%
Test Time: 500± 12 Hours
4
Low Temperature
Temperature: -40 ± 2 o C
Test Time: 500± 12 Hours
5
Temperature and
Humidity Cycle
Step
Temp
Humidity
Time
1
25± 2 o C
95~100%RH
3.0Hr
2
25± 2 o C
95~96%RH
9.5Hr
3
25± 2 o C
95~100%RH
9.5Hr
6
Vibration
Frequency: 10Hz~50Hz
Amplitude: 1.5mm
Direction: X,Y,Z
Time: 2 Hours each
7
IR Reflow Soldering
Solder: H63A(eutectic solder)
Solder Temp.: 232± 5 o C
Time: 6 minutes
Cycles: x 1
Inductance shall be within ± 20% of the initial value.DCR value shall be within ± 20% of the initial value.
8
Soldering Heat
Resistance
Preheat:120 ~ 150 o C (60 sec)
Solder:H63A(eutectic solder)
Solder Temp.: 260 ± 5 o C
Flux: Rosin
Dip time: 10± 1 seconds
The chip must have no cracks.More than 75% of the terminal electrode must be covered with
solder. For 96.5 Sn / 3.5 Ag Solder Past: > 217 o C / 90 Seconds.
For 63.0 Sn / 37 Pb Solder Past: > 183 o C / 120 Seconds.